Deep reactive ion etching (DRIE) for MEMS
Deep reactive ion etching is a foundational technique for MEMS fabrication and a form of dry etching. It offers exceptional etch anisotropy and mask selectivity. We use it to create deep, vertical sided features, often with high aspect ratios. We specialize in deep reactive ion etching of silicon and other substrates as part of our full range of MEMS technologies.
Using DRIE etching in combination with the release process, LioniX is capable of producing free moving silicon actuator and sensing structures on SOI wafers (true MEMS) such as accelerometers, gyroscopes, cantilevers, comb drives and more.