MEMS process capabilities underpinning MEMS Technology at LioniX International

The MEMS technology available to our customers is underpinned by a full range of cutting-edge MEMS process capabilities, including DRIE etching, wafer bonding and deposition through the LDCVP process of low stress silicon nitride and LPCVD polysilicon. For a full list of our process capabilities browse the list below or download our technical specification sheet.

LPCVD silicon nitride wafers entering a furnace on a wafer boat