MEMS technologies – deep reactive ion etching and more
With over 20 years of experience in microsystems fabrication, we have developed a valuable array of technologies designed to realize your MEMS project. Deep reactive ion etching and and wafer bonding are key amongst these vital enabling technologies.
Through continual development in our state of the art cleanroom we have refined existing technologies and continue to develop new custom capabilities to in partnership with out customers.
You will find an overview of all of our most important platform technologies and building blocks for MEMS below.