MEMS Technology

Our technologies are based on, but not limited to, the equipment of the renowned MESA+ Nanolab with its quarantined process lines for

  • Ultra Clean Processing         CMOS-like
  • Metal Free Processing          High-T: Thermal oxidation, LPCVD, TEOS
  • In Line Processing                 Glasses, Metals, Polymers

 

 

MEMS TechnologiesApplications
SOI (silicon on insulator)Movable MEMS and MEMS with accurate thickness
DRIE (deep RIE)High aspect ratio etching, Bosch process
Through wafer etching for fluid ports, view ports or other access holes
Movable MEMS
Wafer bondingDirect bonding, anodic bonding, thermocompression bonding, eutectic bonding for 1st level waferscale packaging and microfluidics
Release etchHF Vapor and XeF2
Bonding and etchbackFor composite MEMS structures
Metal encapsulation , dielectric cappingFor high temperature applications, electrical isolation or metal multi layers
Front to back side alignmentFor membranes or back side contacts
Thin membranesSi3N4 thin membranes for example used in TEM and SEM (transmission or scanning electron microscopy) or sensing
CMP (chemical mechanical polishing)For planarization of substrates
Surface micromachiningReleased structures in cavities built of thin layers of polysilicon and silicon dioxide or silicon nitride
PolymersPolyimide, Parylene

 

Standard TechnologiesExample Applications
100 mm wafers Silicon, Fused silica and Borosilicate glasses
Wet etchingBulk micromachining of silicon, isotropic etching of thin films (dielectrics and metals)
RIE (reactive ion etching)Si, SiO2, Si3N4
RIBE (reactive ion beam etching)All materials
Evaporation and sputteringMetals like Al, Au, Cr, Cu, Ni, Pd, Pt, Ta, Ti, Mo,  etc.
LPCVD and PECVD (low pressure and plasma enhanced chemical vapor deposition)Silicon oxides, silicon nitrides, polysilicon and Ta2O5
Ion implantationFETs, diodes, piezoresistors